The Silicon Valley Open Innovation Summit 2014 will take place at EE Live! on April 2nd. This unique event for technical professionals is focused on accelerating product innovation, development, and manufacturing through a rich ecosystem of platforms and components. The Summit links vendors with users to foster innovation, share design challenges, and refine the industry-wide open innovation initiative to improve design productivity. Founded and organized by Flextronics (NASDAQ: FLEX), a leading end-to-end supply chain solutions company, the theme of the Summit is “Accelerating Innovation for the Smart Connected World.”
The Summit will include free courses focused on emerging technologies in Human Machine Interfacing, Connectivity, Sensors & Actuators, Power & Battery Management and Computing and Materials. “With smart phones, smart energy, smart appliances, smart home, smart cars, smart health, and smart clothes – we live in a connected world. These products have led to a rapid increase in product development complexity that far outpaces development productivity, and has created increased pressure on new product development,” said Karen Field, General Manager, EE Live! “We look forward to collaborating with Flextronics to explore these topics and provide our attendees with the content they need to bring new technologies to market.”
In addition Flextronics will be sponsoring the newly added category of Silicon Valley Open Innovation at UBM Tech’s EE Times and EDN annual ACE Awards for the 2015 competition, which will be announced at this years’ event on April 1. We’ll be kicking this off with a networking reception for the ecosystem to meet, greet, and build connections.
To register to attend The Summit, simply select the Open Innovation Summit course in registration. For information on participating in Flextronics Open Innovation Platform, please contact email@example.com